Schneider Electric and AMD have announced the release of the industry’s first jointly developed and validated reference design for the AMD Helios rackscale solution.

The new design delivers a proven, scalable blueprint that enables organisations to deploy high-density AI factories faster, with lower risk and reduced complexity.

The reference design is the first to support the AMD Helios platform, powered by AMD Instinct™ MI455X GPUs, 6th Gen AMD EPYC™ CPUs, AMD Pensando™ Vulcano NICs, and the open ROCm™ software ecosystem. It addresses the growing demands of AI workloads by providing pre-validated guidance across facility power, facility cooling, IT space, and lifecycle software management.

In a statement announcing the solution yesterday, the firm noted that the Helios is designed to deliver breakthrough AI performance through advances in compute, interconnect bandwidth, memory capacity and system-level integration, allowing customers to run larger, more complex AI workloads faster while optimising power and efficiency.

“As AI workloads push data center infrastructure to unprecedented limits, reference designs provide data center architects and operators with tested, scalable designs proven to handle new power densities, thermal requirements and operational complexity,” Schneider Electric stated.

Executive Vice President, Secure Power & Data Centers at Schneider Electric, Manish Kumar, emphasised that the AI-ready reference designs were developed to help organisations reduce risk in their operations.

“Through our collaboration with AMD, we’re delivering an engineering-backed reference design that bridges the gap between advanced AI compute platforms, energy tech, and real-world data center implementation, enabling customers to deploy scalable, high-density AI environments with greater confidence, efficiency, and speed,” he said.

On his part, the Executive Vice President and General Manager, Data Center Solutions Business Group, AMD, Forrest Norrod, noted that AI infrastructure is rapidly moving to full-scale AI factories, which requires compute, networking, power and cooling to be designed together from the start.

“AMD Helios provides an open, rack-scale architecture built to deliver the performance, efficiency and flexibility required for next-generation AI workloads,” he said.